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I. Magnetic Method: A Convenient and Efficient Non-Destructive Method for Electroplating Thickness Measurement
The magnetic method is one of the most widely used methods for measuring electroplating thickness. Its core principle is based on the relationship between changes in magnetic flux and plating thickness. When a magnetic probe contacts a magnetic substrate with a non-magnetic plating, changes in plating thickness directly lead to changes in the magnetic flux between the probe and the substrate. The instrument captures this change and can accurately calculate the electroplating thickness.

From an advantage perspective, the biggest advantages of the magnetic method for measuring electroplating thickness are its ease of operation, high efficiency, and non-destructive nature. No pre-treatment such as cutting or grinding of the sample is required during the testing process; testing can be performed directly on the surface of the finished workpiece, greatly shortening the testing cycle, making it particularly suitable for batch testing scenarios on production lines. At the same time, this method has relatively low technical requirements for operators; simple training is sufficient to operate the method, effectively reducing enterprise testing costs.

II. Eddy Current Method: A Method for Measuring Electroplated Layer Thickness on Non-Magnetic Substrates

The eddy current method is another important method for measuring electroplated layer thickness, based on electromagnetic induction. During testing, the instrument probe generates an alternating magnetic field. When the probe approaches a conductive plating layer on a non-magnetic substrate, the alternating magnetic field induces eddy currents within the plating layer. The intensity of these eddy currents is closely related to the plating thickness. By analyzing the eddy current feedback signal, the instrument can accurately calculate the plating thickness.

Compared to the magnetic method, the core advantage of the eddy current method lies in its adaptability to measuring plating on non-magnetic substrates. Whether it's conductive plating on non-magnetic metal substrates such as aluminum, copper, and stainless steel, or on non-metallic substrates such as plastics, the eddy current method can achieve accurate detection, effectively overcoming the limitations of the magnetic method. Furthermore, the eddy current method is non-destructive, causing no damage to the workpiece, and offers high accuracy, meeting the requirements for precise measurement of thin plating layers. It is widely used in fields with stringent precision requirements, such as electronics and aerospace.

III. Metallography: A High-Precision Destructive Method for Measuring Electroplating Thickness
Metallography is a highly precise method for measuring electroplating thickness, belonging to destructive testing. The procedure involves first cutting and sampling the workpiece to be tested, followed by metallographic sample preparation processes such as mounting, grinding, polishing, and etching to clearly expose the cross-section between the plating and the substrate. Finally, the cross-section is observed using a metallographic microscope, and the electroplating thickness is directly measured using specialized software or a ruler.