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Electroplating, with its advantages of low cost and strong adaptability, is widely used in the preparation of various electromagnetic shielding layers. However, the problem of poor conductivity persists, with the core reasons concentrated in three key aspects. From the perspective of substrate pretreatment, if surface degreasing, derusting, and roughening processes are inadequate, residual oil and oxide layers will form an insulating barrier, directly blocking the tight bonding between the electroplated layer and the substrate, thus obstructing the current conduction path. This is the primary cause of poor conductivity in electroplated electromagnetic shielding layers.

Furthermore, the control of electroplating process parameters is crucial. Even slight deviations in parameters such as current density, plating bath temperature, and pH value can cause fluctuations in plating quality. Excessively high current density can lead to coarse crystals and burrs in the plating layer, while too low a current density will result in slow deposition and uneven thickness; both will disrupt the continuity of the conductive network. Imbalanced plating bath temperature affects the deposition rate of metal ions, and abnormal pH values ​​interfere with the stability of the plating bath. These process malfunctions ultimately lead to poor conductivity in electroplated electromagnetic shielding layers.

Conductivity is a core performance indicator of electromagnetic shielding layers. The harm caused by poor conductivity in electroplated electromagnetic shielding layers extends far beyond the scope of a single process, impacting the entire industry chain. For terminal electronic devices, shielding layers with insufficient conductivity cannot effectively block electromagnetic interference, leading to internal signal crosstalk, data transmission distortion, and in severe cases, system crashes and functional failures, directly affecting user experience and even threatening safe equipment operation.

In industrial production, poor conductivity in electroplated electromagnetic shielding layers significantly reduces product yield. To compensate for conductivity defects, companies are forced to rework repeatedly, increasing costs for raw materials, labor, and equipment wear and tear, slowing down production, missing delivery deadlines, and weakening market competitiveness. More importantly, in specialized fields with extremely high electromagnetic compatibility requirements, such as medical, aerospace, and military industries, poor conductivity electromagnetic shielding layers can pose significant safety hazards. If equipment malfunctions due to shielding failure, the consequences are unimaginable. This makes the issue of poor conductivity in electroplated electromagnetic shielding layers a red line that cannot be crossed in the industry.